We have developed break through vacuum deposition technologies (PVD and PECVD) that are intrinsic uniform, increase material utilization/cost 2.5 times, increase throughput 4x to 10x at similar cost, increase mean time between PM by 10x and cause minimum plasma damages to substrates..

We worked with customers to provide the best solution suitable for each application, carry out custom engineering, and work with suppliers/partners to deliver the solutions.



Production Systems with near 100% Material Utilization at a Fraction of Cost

Email me at george.guo@ascentool.com